School of Mechanical & Mining Engineering

Mr Keith Sweatman

Adjunct Senior Fellow
School of Mechanical and Mining Engineering

Publications

Journal Articles (13)
Conference Papers (14)

Journal Articles

Nogita, Kazuhiro, Tan, Xin Fu, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Somidin, Flora, Zeng, Guang, Maeno, Hiroshi, Yasuda, Kazuhiro and Gourlay, Christopher M. (2025). In situ observation of deformation in a Sn-3Ag-0.5Cu/Cu solder joint using high-voltage transmission electron microscopy. Materials, 18 (16) 3925, 1-11. doi: 10.3390/ma18163925
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Thermal stability of Bi in Sn-Cu and Sn-Ag-Cu based high strength Pb-free solder alloys. Transactions of The Japan Institute of Electronics Packaging, 18, E24-006-1-E24-006-7. doi: 10.5104/jiepeng.18.e24-006-1
Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974
Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1
Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934
Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4
Somidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1
Zeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247
Sweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 (11), 68-77.
Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012
Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38.
Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi and Dahle, Arne K. (2005). Microstructure control in Sn-0.7mass%Cu alloys. Materials Transactions, 46 (11), 2419-2425. doi: 10.2320/matertrans.46.2419

Conference Papers

Nogita, Kazuhiro, Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Maeno, Hiroshi, Matsumura, Syo and Yasuda, Kazuhiro (2026). In-situ observation of dislocation movement, accumulation and crack propagation during tensile loading in Sn and Sn-based solder alloys. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), Hiroshima, Japan, 14-18 April 2026. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep-hbs69241.2026.11550492
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431
Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406
Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122
Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677
Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP).
Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.
Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.
Sweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012.
Sweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011.
Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526
Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.
Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008.