Professor Kazuhiro Nogita
Professor
School of Mechanical and Mining Engineering
Affiliate of Centre for Advanced Materials Processing and Manufacturing (AMPAM)
Centre for Advanced Materials Processing and Manufacturing
Centre Director of Nihon Superior Centre for the Manufacture of Electronic Materials
Nihon Superior Centre for the Manufacture of Electronic Materials
+61 7 336 53919
Researcher biography
Prof Kazuhiro Nogita's research interests are in: working on Pb-free solder alloys and intermetallics, hydrogen storage alloys, Li-ion battery anode materials, Zn-Al coating alloys and structural Al-Si and Mg alloys. The unifying theme throughout his research career has been the development of environmentally sustainable materials solutions for conventional and alternative electronic, transport and power industries.
Prof Nogita graduated as an Engineer in Japan in 1990 and worked in the nuclear power industry with Hitachi Ltd. for several years. He was awarded a PhD from Kyushu University in 1997 and has subsequently worked on a variety of research projects, including the development of materials for alternative power industries and environmentally friendly applications. He migrated to Australia in 1999 after accepting a position at the University of Queensland, where he currently holds the title of Professor and Director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) within the School of Mechanical & Mining Engineering, and a founding manager of The University of Queensland - Kyushu University Oceania Project ("UQ-KU Project"). He is also an invited Professor at Kyushu University and at the University of Malaysia Perlis.
Currently, the majority of Prof Nogita's research is in two major areas, namely lead-free solders for electronic applications and metal based hydrogen-storage alloys. He holds 15 international patents and has authored over 200 refereed scientific papers. His research has been acknowledged with several awards/fellowships, including Queensland Government Smart Futures Fellowship and he has been instrumental in the establishment of a spin-off company, Hydrexia Pty. Ltd.
Journal Articles
Hao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys. Materials, 17 (17) 4372, 4372. doi: 10.3390/ma17174372
Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase Transformations and Mechanical Properties in In–Bi–Sn Alloys as a Result of Low-Temperature Storage. Materials, 17 (15) 3669, 3669. doi: 10.3390/ma17153669
Tian, He, Qu, Dongdong, Setargew, Nega, Parker, Daniel J., Paterson, David J., StJohn, David and Nogita, Kazuhiro (2024). Characterisation of Fe Distribution in the Liquid–Solid Boundary of Al–Zn–Mg–Si Alloy Using Synchrotron X-ray Fluorescence Microscopy. Materials, 17 (14) ARTN 3583, 3583. doi: 10.3390/ma17143583
Tan, C. Y., Mohd Salleh, M. A.A., Saud, N., Nishimura, T. and Nogita, K. (2024). Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy. Journal of Materials Science: Materials in Electronics, 35 (20) 1408. doi: 10.1007/s10854-024-13164-5
Tian, He, Qu, Dongdong, Tong, Zherui, Setargew, Nega, Parker, Daniel J., StJohn, David and Nogita, Kazuhiro (2024). Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si Alloy. Corrosion Science and Technology, 23 (2), 104-112. doi: 10.14773/CST.2024.23.2.104
Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974
Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1
Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes. Transactions of The Japan Institute of Electronics Packaging, 17, E23-009. doi: 10.5104/jiepeng.17.e23-009-1
Kawami, Youichirou, Tran, Xuan Quy, Yamamoto, Tomokazu, Yoshioka, Satoru, Murakami, Yasukazu, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2024). Cu-Atom Locations in Rocksalt SnTe Thermoelectric Alloy. Advanced Materials. doi: 10.1002/adma.202410508
Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383
Chang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H. and Nogita, K. (2023). Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows. Journal of Materials Research and Technology, 26, 8670-8687. doi: 10.1016/j.jmrt.2023.09.139
Chang, M.S., Mohd Salleh, M.A.A., Somidin, F., Halin, D.S.C., Yasuda, H. and Nogita, K. (2023). The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint. Materials Science and Engineering A: Structural Materials: Properties, Microstructures and Processing, 882 145457, 145457. doi: 10.1016/j.msea.2023.145457
Tan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054
Yao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015
Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934
Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor and Vizureanu, Petrica (2023). Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis. Materials, 16 (12) 4360, 1-17. doi: 10.3390/ma16124360
Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y
Qu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211
Nogita, Kazuhiro (2023). Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で，日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。. Journal of Japan Institute of Electronics Packaging, 26 (6), 571-576. doi: 10.5104/jiep.26.571
Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321
Tan, C.Y., Salleh, M.A.A.Mohd, Saud, N., Chaiprapa, J. and Nogita, K. (2022). Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge. Journal of Materials Research and Technology, 21, 3301-3312. doi: 10.1016/j.jmrt.2022.10.128
Luo, Qun, Cai, Qi, Gu, Qinfen, Shi, Yu, Liu, Bin, Tran, Xuan Quy, Matsumura, Syo, Zhang, Tong-Yi, Nogita, Kazuhiro, Lyu, Tao, Li, Qian and Pan, Fusheng (2022). Negative thermal expansion and phase transition of low-temperature Mg2NiH4. Journal of Magnesium and Alloys, 11 (9), 3338-3349. doi: 10.1016/j.jma.2022.09.012
Kawami, Youichirou, Tran, Xuan Quy, Aso, Kohei, Yamamoto, Tomokazu, Wang, Yuan, Li, Meng, Yago, Anya, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2022). Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe. Small, 18 (42) 2204225, 1-12. doi: 10.1002/smll.202204225
Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538
Tan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221
Abdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248
Amli, S. F. Muhd, Salleh, M. A. A. Mohd, Ramli, M. I. I., Aziz, M. S. Abdul, Yasuda, H., Chaiprapa, J. and Nogita, K. (2022). Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science: Materials in Electronics, 33 (17), 14249-14263. doi: 10.1007/s10854-022-08353-z
Kim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102
Tan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056
Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki and Sandu, Ioan Gabriel (2022). Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow. Materials, 15 (8) 2758, 2758. doi: 10.3390/ma15082758
Chang, M. S., Salleh, M. A. A. Mohd, Halin, D. S. C., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2022). The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy. Journal of Alloys and Compounds, 897 163172, 1-10. doi: 10.1016/j.jallcom.2021.163172
Ramli, M. I.I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad and Nogita, K. (2022). Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging. JOM, 74 (7), 2760-2769. doi: 10.1007/s11837-022-05229-9
Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661
Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4
Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro and Matsumura, Syo (2022). Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. Acta Materialia, 224 117513, 117513. doi: 10.1016/j.actamat.2021.117513
Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510
Zeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x
Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295
Zhu, Suming, Abbott, Trevor B., Nie, Jian-Feng, Ang, Hua Qian, Qiu, Dong, Nogita, Kazuhiro and Easton, Mark A. (2021). Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44. Journal of Magnesium and Alloys, 9 (5), 1537-1545. doi: 10.1016/j.jma.2021.04.016
Tan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031
Liu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168
Kim, Manjin, Gu, Qinfen, Hussain, Tanveer, Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2021). The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloys. International Journal of Hydrogen Energy, 46 (53), 27096-27106. doi: 10.1016/j.ijhydene.2021.05.180
Abdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520
Teoh, A.L., Mohd Salleh, M.A.A., Halin, D.S.C., Foo, K.L., Abdul Razak, N.R., Yasuda, H. and Nogita, K. (2021). Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG). Journal of Materials Research and Technology, 12, 1700-1714. doi: 10.1016/j.jmrt.2021.03.068
Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3
Halin, Dewi Suriyani Che, Razak, Kamrosni Abdul, Mohd Salleh, Mohd Arif Anuar, Ramli, Mohd Izrul Izwan, Abdullah, Mohd Mustafa Al Bakri, Azhari, Ayu Wazira, Nogita, Kazuhiro, Yasuda, Hideyuki, Nabiałek, Marcin and Wysłocki, Jerzy J. (2021). Microstructure evolution of Ag/TiO2 thin film. Magnetochemistry, 7 (1) 14, 1-10. doi: 10.3390/magnetochemistry7010014
Yasuda, Hideyuki and Nogita, Kazuhiro (2021). Evaluation of wave-like nucleation events in Al-4%Si alloys with addition of TiB2 particles by time-resolved and in-situ observation 時間分解・その場観察による TiB2 添加 Al-4%Si 合金の波状核生成現象の評価. Keikinzoku/Journal of Japan Institute of Light Metals, 71 (1), 22-29. doi: 10.2464/jilm.71.22
Muhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Abdul Razak, N. R., Yasuda, H., Chaiprapa, J. and Nogita, K. (2021). Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength. Journal of Electronic Materials, 50 (3), 855-868. doi: 10.1007/s11664-020-08641-6
Kim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068
Tan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011
Muhd Amli, S. F.N., Mohd Salleh, M. A.A., Ramli, M. I.I., Yasuda, H., Chaiprapa, J., Somidin, F., Shayfull, Z. and Nogita, K. (2020). Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical properties. Journal of Electronic Materials, 50 (3), 710-722. doi: 10.1007/s11664-020-08428-9
Tan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538
Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529
Yang, Wenhui, Quy Tran, Xuan, Yamamoto, Tomokazu, Yoshioka, Satoru, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2020). Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5. Physical Review Materials, 4 (6) 065002. doi: 10.1103/physrevmaterials.4.065002
Liu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221
Qu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669
Mohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2020). Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste. Journal of Materials Science: Materials in Electronics, 31 (14), 11077-11094. doi: 10.1007/s10854-020-03657-4
Liu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032
Somidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1
Somidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530
Ramli, M. I.I., Mohd Salleh, M. A.A., Yasuda, H., Chaiprapa, J. and Nogita, K. (2020). The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering. Materials and Design, 186 108281, 108281. doi: 10.1016/j.matdes.2019.108281
Ramli, M. I.I., Mohd Salleh, M. A.A., Abdullah, M. M.A., Narayanan, P., Chaiprapa, J., Mohd Said, R., Yoriya, S. and Nogita, K. (2020). The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings. Journal of Electronic Materials, 49 (1), 1-12. doi: 10.1007/s11664-019-07596-7
Liu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4
Tan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014
Tan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085
Liu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630
Zeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153
Wong, Charlotte, Nogita, Kazuhiro, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2019). Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram. Journal of Alloys and Compounds, 784, 527-534. doi: 10.1016/j.jallcom.2019.01.029
Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034
Ramli, M.I.I., Mohd Salleh, M.A.A., Mohd Sobri, F. A., Narayanan, P., Sweatman, K. and Nogita, K. (2019). Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering. Journal of Materials Science: Materials in Electronics, 30 (4), 3669-3677. doi: 10.1007/s10854-018-00647-5
Henao, Hector M., Chu, Ching-shun, Solis, Juan P. and Nogita, Kazuhiro (2019). Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applications. Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, 50 (1), 502-516. doi: 10.1007/s11663-018-1456-8
Yang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158, 1-5. doi: 10.1016/j.scriptamat.2018.08.020
Peng, L., Zeng, G., Su, T. C., Yasuda, H., Nogita, K. and Gourlay, C. M. (2019). Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys. JOM, 71 (7), 2235-2244. doi: 10.1007/s11837-019-03471-2
Somidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229
Xian, J. W., Mohd Salleh, M. A.A., Belyakov, S. A., Su, T. C., Zeng, G., Nogita, K., Yasuda, H. and Gourlay, C. M. (2018). Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni. Intermetallics, 102, 34-45. doi: 10.1016/j.intermet.2018.08.002
Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251
Liu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384, 1384. doi: 10.3390/ma11081384
Liu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038
Somidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018). Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138, 113-119. doi: 10.1016/j.matchar.2018.02.006
Nogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Abdullah, Mohd Mustafa Al Bakri, Jamaludin, Liyana and Mohd Tahir, Muhammad Faheem (2018). Preface. Solid State Phenomena, 273 SSP
Xian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K. and Gourlay, C. M. (2017). Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta Sn. Intermetallics, 91, 50-64. doi: 10.1016/j.intermet.2017.08.002
Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2017). Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'. Scientific Reports, 7 (1) 43720, 1-3. doi: 10.1038/srep43720
Mohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031
Xian, J. W., Belyakov, S. A., Ollivier, M., Nogita, K., Yasuda, H. and Gourlay, C. M. (2017). Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Materialia, 126, 540-551. doi: 10.1016/j.actamat.2016.12.043
Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105
Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010
Yasuda, Hideyuki, Nagira, Tomoya, Yoshiya, Masato, Morishita, Kohei and Nogita, Kazuhiro (2017). Time-resolved and in-situ observation of solidification phenomena. Journal of the Japan Welding Society, 86 (5), 362-363.
Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd and Nogita, Kazuhiro (2016). The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds, 685, 471-482. doi: 10.1016/j.jallcom.2016.05.263
Nogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D. and Matsumura, S. (2016). In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. JOM, 68 (11), 2871-2878. doi: 10.1007/s11837-016-2020-0
Tran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007
Salleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Yasuda, H. and Nogita, K. (2016). Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles. Materials and Design, 108, 418-428. doi: 10.1016/j.matdes.2016.06.121
Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110
Mohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016). Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700, 161-169. doi: 10.4028/www.scientific.net/KEM.700.161
Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 (9), 1316-1327. doi: 10.1557/jmr.2016.123
Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001
Ye, Delai, Zeng, Guang, Nogita, Kazuhiro, Ozawa, Kiyoshi, Hankel, Marlies, Searles, Debra J and Wang, Lianzhou (2015). Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries. Advanced Functional Materials, 25 (48), 7488-7496. doi: 10.1002/adfm.201503276
Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069
Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x
Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077
Tran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044
Mohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039
Henao, Hector M, Masuda, Chisato and Nogita, Kazuhiro (2015). Metallic tin recovery from wave solder dross. International Journal of Mineral Processing, 137, 98-105. doi: 10.1016/j.minpro.2015.02.006
Mohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508
Wen, Yanfen, Wang, Bei, Zeng, Guang, Nogita, Kazuhiro, Ye, Delai and Wang, Lianzhou (2015). Electrochemical and structural study of layered P2-type Na2/3Ni1/3Mn2/3O2 as cathode material for sodium-ion battery. Chemistry - An Asian Journal, 10 (3), 661-666. doi: 10.1002/asia.201403134
Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003
Henao, Hector M., Sugiyama, Akira and Nogita, Kazuhiro (2014). Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system. Journal of Alloys and Compounds, 613, 132-138. doi: 10.1016/j.jallcom.2014.05.184
Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004
Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027
Zeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0
Zeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247
Sweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41.
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012
Nogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro and StJohn, David H. (2013). Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys. Materials Characterization, 85, 134-140. doi: 10.1016/j.matchar.2013.08.015
Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381
Salleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013). A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 (7), 725-728.
Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012
Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057
Mu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013). Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 (2), 304-311. doi: 10.1007/s11664-012-2227-y
McDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3
Nogita, K., McDonald, S., Duguid, A., Tsubota, M. and Gu, Q. F. (2013). Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2. Journal of Alloys and Compounds, 580 (SUPPL1), S140-S143. doi: 10.1016/j.jallcom.2013.01.006
Nogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D. and Uesugi, Kentaro (2013). Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys. Advanced Materials Research, 626, 200-204. doi: 10.4028/www.scientific.net/AMR.626.200
Sweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 (11), 68-77.
Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012). A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 (19), 6581-6591. doi: 10.1016/j.actamat.2012.08.024
Mu, D., Huang, H. and Nogita, K. (2012). Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46-49. doi: 10.1016/j.matlet.2012.07.018
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247
Mu, Dekui, Yasuda, Hideyuki, Huang, Han and Nogita, Kazuhiro (2012). Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 38-46. doi: 10.1016/j.jallcom.2012.04.110
Zeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018
Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047
Yan, M, Kohara, S., Wang, J. Q., Nogita, K., Schaffer, G. B. and Qian, M. (2011). The influence of topological structure on bulk glass formation in Al-based metallic glasses. Scripta Materialia, 65 (9), 755-758. doi: 10.1016/j.scriptamat.2011.07.009
Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058
Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293
Gourlay, C.M., Dahle, A. K., Nagira, T., Nakatsuka, N., Nogita, K., Uesugi, K. and Yasuda, H. (2011). Granular deformation mechanisms in semi-solid alloys. Acta Materialia, 59 (12), 4933-4943. doi: 10.1016/j.actamat.2011.04.038
Gourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M. and Yasuda, H. (2011). In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59 (10), 4043-4054. doi: 10.1016/j.actamat.2011.03.028
Tsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012
Nogita, Kazuhiro (2011). A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 (3), 196-200.
Yasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742.
Nogita, Kazuhiro (2011). Eutectic modification and porosity formation in Al-Si alloys. Journal of Japan Foundry Engineering Society, 83 (2), 167-175.
野北 和宏 [Nogita, Kazuhiro] (2010). Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 (11), 20-26.
Tsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010). Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 (1-3), 162-171. doi: 10.1016/j.mseb.2010.03.092
Schwingenschlogl, U., Di Paola, C., Nogita, K. and Gourlay, C. M. (2010). The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5. Applied Physics Letters, 96 (6) 061908, 061908-1-061908-3. doi: 10.1063/1.3310019
Nogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138
Nogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010). Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 40-46.
Nogita, Kazuhiro, Greaves, Mathew C., Guymer, Benjamin D., Walsh, Bernard B., Kennedy, James M., Duke, Michael D. and Nishimura, Tetsuro (2010). The performance of lead-free solders during a long-distance electric vehicle race. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 104-109.
Gourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5
Nogita, Kazuhiro (2010). Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1), 145-149. doi: 10.1016/j.intermet.2009.07.005
Tsukamoto, H, Nishimura, T and Nogita, K (2009). Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface. MATERIALS LETTERS, 63 (30), 2687-2690. doi: 10.1016/j.matlet.2009.09.041
Yasuda, Hideyuki, Nogita, Kazuhiro, Gourlay, Christopher, Yoshiya, Masato and Nagira, Tomoya (2009). In-situ observation of Sn alloy solidification at SPring8. Journal of the Japan Welding Society, 78 (7), 6-9. doi: 10.2207/jjws.78.600
Nogita, K., Ockert, S., Pierce, J., Greaves, M.C., Gourlay, C.M. and Dahle, A.K. (2009). Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloys. PERGAMON-ELSEVIER SCIENCE LTD, 34 (18), 7686-7691. doi: 10.1016/j.ijhydene.2009.07.036
Tsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2009). Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates. Materials Science and Engineering B, 164 (1), 44-50. doi: 10.1016/j.mseb.2009.06.013
Nogita, Kazuhiro, Gourlay, C. M and Nishimura, T (2009). Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM (A publication of The Minerals, Metals & Materials Society), 61 (6), 45-51. doi: 10.1007/s11837-009-0087-6
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54.
Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38.
Bermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002
Nogita, K. and Nishimura, T. (2008). Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 (2), 191-194. doi: 10.1016/j.scriptamat.2008.03.002
Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713
Gourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8
Ventura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel and Dahle, Arne K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37 (1), 32-39. doi: 10.1007/s11664-007-0281-7
Knibbe, Ruth, Nogita, Kazuhiro, Drennan, John, Noguchi, Tsuneyuki, Tatenuma, Katsuyoshi, Liu, Pou, Arai, Fumihito, Yashima, Eiji, Nishiwaki, Michiru and Kato, Shigeki (2007). Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition. Journal of Nanoparticle Research, 9 (6), 1201-1204. doi: 10.1007/s11051-006-9207-1
Nogita, K, Yasuda, H, Yoshida, K, Uesugi, K, Takeuchi, A, Suzuki, Y and Dahle, AK (2006). Determination of strontium segregation in modified hypoeutectic Al-Si alloy by micro X-ray fluorescence analysis. Scripta Materialia, 55 (9), 787-790. doi: 10.1016/j.scriptamat.2006.07.029
Kumari, SSS, Pillai, RM, Nogita, K, Dahle, AK and Pai, BC (2006). Influence of calcium on the microstructure and properties of an Al-7Si-0.3Mg-xFe alloy. Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science, 37A (8) 2581, 2581-2587. doi: 10.1007/BF02586230
McDonald, S. D., Nogita, K. and Dahle, A. K. (2006). Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys. Journal of Alloys and Compounds, 422 (1-2), 184-191. doi: 10.1016/j.jallcom.2005.11.070
Gourlay, CM, Nogita, K, McDonald, SD, Nishimura, T, Sweatman, K and Dahle, AK (2006). A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu. Scripta Materialia, 54 (9), 1557-1562. doi: 10.1016/j.scriptamat.2006.01.025
Dargusch, M. S., Pettersen, K., Nogita, K., Nave, M. D. and Dunlop, G. L. (2006). The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloys. Materials Transactions, 47 (4), 977-982. doi: 10.2320/matertrans.47.977
Dahle, A. K., Nogita, K., McDonald, S. D., Dinnis, C. M. and Lu, L. (2005). Eutectic modification and microstructure development in Al-Si alloys. Materials Science And Engineering A-structural Materials Properties Microstructure And Processing, 413-414 (International Conference on Advances in Solidification Processes), 243-248. doi: 10.1016/j.msea.2005.09.055
Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi and Dahle, Arne K. (2005). Microstructure control in Sn-0.7mass%Cu alloys. Materials Transactions, 46 (11), 2419-2425. doi: 10.2320/matertrans.46.2419
Nogita, K., Schaffer, P. L., McDonald, S. D., Lu, L. and Dahle, A. K. (2005). Modification of Al-Si alloys. Aluminium, 81 (4), 330-335.
Lu, L, Nogita, K and Dahle, AK (2005). Combining Sr and Na additions in hypoeutectic Al-Si foundry alloys. Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing, 399 (1-2), 244-253. doi: 10.1016/j.msea.2005.03.091
Hatano, Y., Takamori, M., Nogita, K., Matsuda, K., Ikeno, S. and Watanabe, K. (2005). Influence of microstructure of tungsten on solid state reaction rate with amorphous carbon film. Journal of Nuclear Materials, 337-39 (1-3), 902-906. doi: 10.1016/j.jnucmat.2004.10.098
Dahle, A. K., McDonald, S. D. and Nogita, K. (2004). Erratum: Eutectic Solidification of Al-Si Alloys (Metallurgical and Materials Transactions A (2003), 34A (2690-2693)). Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 35 A (3)
Nogita, K, McDonald, SD and Dahle, AK (2004). Eutectic modification of Al-Si alloys with rare earth metals. Materials Transactions, 45 (2), 323-326. doi: 10.2320/matertrans.45.323
Nogita, K., McDonald, S. D. and Dahle, A. K. (2004). Solidification mechanisms of unmodified and strontium-modified hypereutectic aluminium-silicon alloys. Philosophical Magazine, 84 (17), 1683-1696. doi: 10.1080/14786430310001659803
Nogita, K., McDonald, S. D. and Dahle, A. K. (2004). Modification of Al-Si alloys. Materials Forum - Aluminium Alloys Their Physical and Mechanical Properties, 28, 945-950.
Nogita, K. and Dahle, A. K. (2004). Porosity formation and eutectic modification mechanism of hypoeutectic Al-SI alloys. Journal of Japan Institute of Light Metals, 54 (10), 440-446. doi: 10.2464/jilm.54.440
Nogita, K, McDonald, SD, Tsujimoto, K, Yasuda, K and Dahle, AK (2004). Aluminium phosphide as a eutectic grain nucleus in hypoeutectic Al-Si alloys. Journal of Electron Microscopy, 53 (4), 361-369. doi: 10.1093/jmicro/dfh048
Une, K, Nogita, K, Ishimoto, S and Ogata, K (2004). Crystallography of zirconium hydrides in recrystallized Zircaloy-2 fuel cladding lay electron backscatter diffraction. Journal of Nuclear Science And Technology, 41 (7), 731-740. doi: 10.3327/jnst.41.731
Bowles, A. L., Nogita, K., Dargusch, M. S., Davidson, C. and Griffiths, J. (2004). Grain size measurements in Mg-Al high pressure die castings using electron back-scattered diffraction (EBSD). Materials Transactions, 45 (11), 3114-3119. doi: 10.2320/matertrans.45.3114
McDonald, S. D., Nogita, K. and Dahle, A. K. (2004). Eutectic nucleation in Al-Si alloys. Acta Materialia, 52 (14), 4273-4280. doi: 10.1016/j.actamat.2004.05.043
Lu, L, Nogita, K, McDonald, SD and Dahle, AK (2004). Eutectic solidification and its role in casting porosity formation. JOM (A publication of The Minerals, Metals & Materials Society), 56 (11), 52-58. doi: 10.1007/s11837-004-0254-8
Dargusch, MS, Pettersen, K, Bakke, P, Nogita, K, Bowles, AL and Dunlop, GL (2004). Microstructure and mechanical properties of high pressure die cast magnesium alloy AE42 with 1% strontium. International Journal of Cast Metals Research, 17 (3), 170-173. doi: 10.1179/136404604225017555
Dahle, A. K., McDonald, S. D. and Nogita, K. (2003). Response to Discussion of 'Eutectic modification of Al-Si alloys'. Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science, 34A (11), 2690-2693. doi: 10.1007/s11661-003-0031-2
Nogita, K, McDonald, SD and Dahle, AK (2003). Effects of boron-strontium interactions on eutectic modification in Al-10 mass%Si alloys. Materials Transactions, 44 (4), 692-695. doi: 10.2320/matertrans.44.692
Nogita, K. and Dahle, A. K. (2003). Effects of boron on eutectic modification of hypoeutectic Al-Si alloys. Scripta Materialia, 48 (3), 307-313. doi: 10.1016/S1359-6462(02)00381-0
Nogita, K., Drennan, J. and Dahle, A. K. (2003). Evaluation of silicon twinning in hypo-eutectic Al-Si alloys. Materials Transactions, 44 (4), 625-628. doi: 10.2320/matertrans.44.625
Heiberg, G., Nogita, K., Dahle, A. K. and Arnberg, L. (2002). Columnar to equiaxed transition of eutectic in hypoeutectic aluminium-silicon alloys. Acta Materialia, 50 (10), 2537-2546. doi: 10.1016/S1359-6454(02)00081-2
Heiberg, G., Nogita, K., Raanes, M., Dons, A. L., Dahle, A. K. and Arnberg, L. (2002). Effect of magnesium, iron and copper on eutectic solidification of hypoeutectic aluminium-silicon alloys. Transactions of the American Foundrymen's Society, 110, 347-358.
Dahle, A. K., Nogita, K., Zindel, J. W., McDonald, S. D. and Hogan, L. M. (2001). Eutectic nucleation and growth in hypoeutectic Al-SI alloys at different strontium levels. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science 35A, 32 (4) 352, 949-960. doi: 10.1007/s11661-001-0352-y
Knuutinen, A., Nogita, K., McDonald, S. D. and Dahle, A. K. (2001). Modification of Al-Si alloys with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 229-240. doi: 10.1016/S1471-5317(02)00004-4
Nogita, K., Knuutinen, A., McDonald, S. D. and Dahle, A. K. (2001). Mechanisms of eutectic solidification in Al-Si alloys modified with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 219-228. doi: 10.1016/S1471-5317(02)00005-6
Nogita, K and Dahle, AK (2001). Eutectic growth mode in strontium, antimony and phosphorus modified hypoeutectic Al-Si foundry alloys. Materials Transactions, 42 (3), 393-396. doi: 10.2320/matertrans.42.393
Knuutinen, A., Nogita, K., McDonald, S. D. and Dahle, A. K. (2001). Porosity formation in aluminium alloy A356 modified with Ba, Ca, Y and Yb. Journal of Light Metals, 1 (4), 241-249. doi: 10.1016/S1471-5317(02)00006-8
Kashibe, S., Nogita, K. and Une, K. (2001). Irradiation-induced microstructure change and fuel performance of high burn-up LWR fuels. Journal of Nuclear Science and Technology, 288, 280-280.
Nogita, K and Dahle, AK (2001). Eutectic solidification in hypoeutectic Al-Si alloys: electron backscatter diffraction analysis. Materials Characterization, 46 (4), 305-310. doi: 10.1016/S1044-5803(00)00109-1
Nogita, K., McDonald, S. D., Zindel, J. W. and Dahle, A. K. (2001). Eutectic solidification mode in sodium modified Al-7 mass %Si-3.5 mass %Cu-0.2 mass %Mg casting alloys. Materials Transactions, 42 (9), 1981-1986. doi: 10.2320/matertrans.42.1981
Nogita, K and Dahle, AK (2001). Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD. Materials Transactions Jim, 42 (2), 207-214. doi: 10.2320/matertrans.42.207
Minato, K., Shiratori, T., Serizawa, H., Hayashi, K., Une, K., Nogita, K., Hirai, M. and Amaya, M. (2001). Thermal conductivities of irradiated UO2 and (U,Gd)O-2. Journal of Nuclear Materials, 288 (1), 57-65. doi: 10.1016/S0022-3115(00)00578-X
Une, K., Nogita, K., Shiratori, T. and Hayashi, K. (2001). Rim structure formation of isothermally irradiated UO2 fuel discs. Journal of Nuclear Materials, 288 (1), 20-28. doi: 10.1016/S0022-3115(00)00712-1
Une, K., Hirai, M., Nogita, K., Hosokawa, T., Suzawa, Y., Shimizu, S. and Etoh, Y. (2000). Rim structure formation and high burnup fuel behavior of large-grained UO2 fuels. Journal of Nuclear Materials, 278 (1), 54-63. doi: 10.1016/S0022-3115(99)00214-7
Nogita, K., Hayashi, K., Une, K. and Fukuda, K. (1999). Depth profiles of damage accumulation in UO2 and (U,Gd)O2 pellets irradiated with 100 MeV iodine. Journal of Nuclear Materials, 273 (3), 302-309. doi: 10.1016/S0022-3115(99)00048-3
Nogita, K. and Une, K. (1998). High resolution TEM observation and density estimation of Xe bubbles in high burnup UO2 fuels. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 141 (1-4), 481-486. doi: 10.1016/S0168-583X(98)00040-8
Nogita, K., Une, K., Hirai, M., Ito, K., Ito, K. and Shirai, Y. (1997). Effect of grain size on recrystallization in high burnup fuel pellets. Journal of Nuclear Materials, 248, 196-203. doi: 10.1016/S0022-3115(97)00156-6
Nogita, Kazuhiro and Une, Katsumi (1997). Formation of pellet-cladding bonding layer in high burnup BWR fuels). Journal of Nuclear Science and Technology, 34 (7), 679-686. doi: 10.1080/18811248.1997.9733726
Nogita, K. and Une, K. (1997). High resolution TEM of high burnup UO2 fuel. Journal of Nuclear Materials, 250 (2-3), 244-249. doi: 10.1016/S0022-3115(97)00282-1
Nogita, K., Une, K. and Korei, Y. (1996). TEM analysis of pellet-cladding bonding layer in high burnup BWR fuel. Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 116 (1-4), 521-526. doi: 10.1016/0168-583X(96)00100-0
Une, K., Kashibe, S. and Nogita, K. (1995). Corrosion behavior of unirradiated oxide fuel pellets in high temperature water. Journal of Nuclear Materials, 227 (1-2), 32-39. doi: 10.1016/0022-3115(95)00141-7
Nogita, K. and Une, K. (1995). Irradiation-induced recrystallization in high burnup UO2 fuel. Journal of Nuclear Materials, 226 (3), 302-310. doi: 10.1016/0022-3115(95)00123-9
Nogita, K. and Une, K. (1994). Radiation-induced microstructural change in high burnup UO2 fuel pellets. Nuclear Inst. and Methods in Physics Research, B, 91 (1-4), 301-306. doi: 10.1016/0168-583X(94)96235-9
Nogita, Kazuhiro and Une, Katsumi (1994). Effect of Grain Size on Microstructural Change and Damage Recovery in UO2 Fuels Irradiated to 23 GWd/t. Journal of Nuclear Science and Technology, 31 (9), 929-936. doi: 10.1080/18811248.1994.9735243
Nogita, Kazuhiro and Une, Katsumi (1994). Effect of Grain Size on Microstructural Change and Damage Recovery in UO2Fuels Irradiated to 23GWd/t. Journal of Nuclear Science and Technology, 31 (9), 929-936. doi: 10.3327/jnst.31.929
Kashibe, S., Une, K. and Nogita, K. (1993). Formation and growth of intragranular fission gas bubbles in UO2 fuels with burnup of 6-83 GWd/t. Journal of Nuclear Materials, 206 (1), 22-34. doi: 10.1016/0022-3115(93)90229-R
Nogita, Kazuhiro and Une, Katsumi (1993). Thermal Recovery of Radiation Defects and Microstructural Change in Irradiated UO2 Fuels. Journal of Nuclear Science and Technology, 30 (9), 900-910. doi: 10.3327/jnst.30.900
Nogita, Kazuhiro and Une, Katsumi (1993). Thermal recovery of radiation defects and microstructural change in irradiated UO2fuels. Journal of Nuclear Science and Technology, 30 (9), 900-910. doi: 10.1080/18811248.1993.9734564
Une, K., Nogita, K., Kashibe, S. and Imamura, M. (1992). Microstructural change and its influence on fission gas release in high burnup UO2 fuel. Journal of Nuclear Materials, 188 (C), 65-72. doi: 10.1016/0022-3115(92)90455-T
Conference Papers
Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. IEEE. doi: 10.23919/icep61562.2024.10535651
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. IEEE. doi: 10.23919/icep61562.2024.10535431
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. IEEE. doi: 10.23919/icep61562.2024.10535619
Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743
Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722
Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707
Hari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62
Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2022). Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process. 23rd Magnesium Technology Symposium at the 151st TMS Annual Meeting and Exhibition, Anaheim, CA, United States, 27 February - 3 March 2022. Cham, Switzlerland: Springer International Publishing. doi: 10.1007/978-3-030-92533-8_12
Somidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye and Nogita, Kazuhiro (2022). Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795417
Nogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610
Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406
Kim, Manjin, Ali, Yahia, McDonald, Stuart D., Abbott, Trevor B. and Nogita, Kazuhiro (2020). The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys. 149th TMS Annual Meeting & Exhibition, San Diego, CA, United States, 23-27 February 2020. Cham, Switzerland: Springer. doi: 10.1007/978-3-030-36647-6_43
Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2019). Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733493
Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009
Somidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006
Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007
Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008
Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594
Wong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13
Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101
Yang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro and Matsumura, Syo (2018). Stem analysis of atom location in (Cu, Au, Ni)6Sn5 intermetallic compounds. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.95
Ramli, M. I.I., Yusof, M. S.S., Mohd Salleh, M. A.A., Said, R. M. and Nogita, K. (2018). Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloy. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.27
Xian, J. W., Mohd Salleh, M. A.A., Zeng, G., Belyakov, S. A., Yasuda, H., Nogita, K. and Gourlay, C. M. (2018). Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidification. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.66
Xuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9
Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2018). Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, Kuwana, Mie, Japan, 17-21 April 2018. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374705
Nogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678
Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3
Somidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14
Tan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20
Nogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399
Zeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82
Nogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343
Watling, K. M., Chandler-Temple, A. and Nogita, K. (2016). XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.63
Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58
Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49
Gourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., Yasuda, H. and Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.44
Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53
Belyakov, S. A., Nishimura, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2016). Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 20-22 April 2016. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.1109/ICEP.2016.7486816
Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122
Prasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014
Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677
Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron and Nishimura, Takatoshi (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826652
Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.
Zeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013.
Barry, J., Yamamoto, T., Gu, Q., Huang, Yang, Matsumura, S. and Nogita, Kazuhiro (2013). New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013.
Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP).
Mohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260
Sweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012.
Nogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012.
Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries.
Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012.
Sweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011.
Mu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging.
Nogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. International Conference on Electronics Packaging 2010, Sapporo, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).
Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).
Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851
Mu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450
Tsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446
Nogita, Kazuhiro (2009). Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys. Switzerland: Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/MSF.618-619.391
Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.
Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.
T. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle (2009). The influence of Ni additions on the solidification of Sn-0.7%Cu solder. Materials and AustCeram 2009 Conference, Gold Coast, Australia, 1-3 July 2009.
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.
Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009.
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.
Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.
Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008.
Tsukamoto, H., Dong, Z., Huang, H., Nishimura, T. and Nogita, K. (2008). Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces. Materials and AustCeram Conference (MAC 2009), Gold Coast, Queensland, 1-3 July 2009.
Nogita, K. and Dahle, A.K. (2007). Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July, 2007. Sheffield, United Kingdom: Department of Engineering Materials, University of Sheffield.
Simensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Great Britain: Department of Engineering Materials, University of Sheffield.
Ventura, T., Nogita, K., Gourlay, C., Nishimura, T., Rappaz, M. and Dahle, A.K. (2007). Solidification characteristics of lead-free solder Sn-0.7Cu-0.06Ni. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. United Kingdom: Department of Engineering Materials, University of Sheffield.
Nogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society.
Lu, L., Nogita, K. and Dahle, A.K. (2007). Refinement of Al-Si Eutectic Grains - A Novel method to produce high integrity Al-Si Alloy Castings. Light Metals 2007, Orlando, Florida, USA, February 25 - March 1 2007. USA: The Minerals, Metals and Materials Society.
Dahle, A.K., Nogita, K. and McDonald, S.D. (2007). Engineering eutectic solidification in Al-Si Alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Sheffield, United Kingdom: University of Sheffield.
Drennan, John, Webb, Rick, Nogita, Kaz, Knibbe, Ruth, Auchterlonie, Graeme, Tatenuma, K. and Hunter, Jane (2006). Analytical electron microscopy of proton exchange membrane fuel cells. International Conference on Solid State Ionics, Baden-Baden, Germany, 17-22 July 2005. Amsterdam, Netherlands: Elsevier. doi: 10.1016/j.ssi.2006.07.016
Hatano, Y., Takamori, M., Nogita, K., Matsuda, K., Ikeno, S. and Watanabe, K. (2005). Influence of microstructure of tungsten on solid state reaction rate with amorphous carbon film. doi: 10.1016/j.jnucmat.2004.10.098
McDonald, S. D., Lu, L., Nogita, K. and Dahle, A. K. (2005). The role of the eutectic in porosity formation in Al-Si foundry alloys. Shape Casting - The John Campbell Symposium - TMS 2005 Annual Meeting, San Francisco, California, 13-17 February 2005 .
Une, K., Nogita, K. and Ogata, K. (2004). Crystallography of zirconium hydride in zircaloy-2 nuclear fuel cladding. Proceedings of 18th Australian Conference on Microscopy & Microanalysis, Geelong, Australia, 2-6 February 2004. Australia: Australian Microscopy and Microanalysis Society Inc.
Nogita, K., Tsujimoto, K., Dahle, A. K. and Drennan, J. (2004). Nucleation of eutectic silicon on aluminium phosphide in hypoeutectic Al-Si alloys. Proceedings of 18th Australian Conference on Microscopy & Microanalysis, Geelong, Australia, 2-6 February 2004. Australia: Australian Microscopy and Microanalysis Society Inc.
Nogita, K., McDonald, S. D., Tsujimoto, K., Yasuda, K. and Dahle, A. K. (2004). Finding eutectic nuclei in hypoeutectic Al-Si alloys by focused ion beam milling. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 28-30 September 2004. Japan: Japan Institute of Metals.
Nogita, K., McDonald, S. D., Dinnis, C. M., Lu, L. and Dahle, A. K. (2004). Recent progress in understanding eutectic solidification in aluminium-silicon foundry alloys. 2004 TMS Annual Meeting and Exhibition, Charlotte, North Carolina, U.S.A., 14-18 March 2004. Warrendale, PA, U.S.A.: The Minerals, Metals and Materials Society.
Tatenuma, K., Noguchi, T., Amano, M., Taguchi, T., Nogita, K., Drennan, J., Mori, T. and Miyazawa, K. (2003). Highly functional carbon materials impregnated with nano-size RuO2 particle. UK - Japan workshop on Nano Science for Energy and Environmenn, Scotland, UK, 11 September 2003. Japan: Japan Society.
Nogita, K., McDonald, S. and Dahle, A. K. (2003). Eutectic modification of hypoeutectic Al-Si alloys with rare earth metals. Proceedings of Japan Institute of Metals Fall Meeting, Japan, 11-13 October 2003. Japan: Japan Institute of Metals.
Amano, M., Shioya, K., Arai, O., Tatenuma, K., Haraguchi, T., Drennan, J. and Nogita, K. (2003). Development of high performance anode catalyst for DMFC and DDFC (1) - Preparation and characterization of the catalyst. Proceedings of Annual Meeting Electrochemical Society of Japan, Japan, 1-3 April 2003. Japan: Electrochemical Society of Japan.
Dahle, A. K., McDonald, S. D. and Nogita, K. (2002). Eutectic solidification in hypoeutectic Al-Si alloys and its effect on porosity. The 17th International Conference of Australian Society for Ey, Materials Solutions 2002, Columbus, OH, USA, 7-9 October 2002. Materials Park, OH 44073-0002, USA: ASM International, Member/Customer Service Center.
Nogita, K., McDonald, S. D. and Dahle, A. K. (2002). Effects of boron on eutectic modification of hypoeutectic Al-Si alloys. 2002 Japan Institute of Metals Fall Meeting, Osaka University, Osaka, Japan, 2-4 November, 2002. Sendai, Japan: Japan Institute of Metals.
Nogita, K., Dahle, A. K. and Drennan, J. (2002). Application of SEM/EBSD and FEG-TEM/CBED to determine eutectic solidificaation mechanisms. The 17th International Conference of Australian Society for Ey, Adelaide Convention Center, Adelaide, South Australia, 4-8 February 2002.
Nogita, K. and Dahle, A. K. (2001). Solidification of the eutectic in hypoeutectic Al-Si alloys. Engineering Materials 2001, Melbourne, Australia, 23-26 Sept 2001. Melbourne, Australia: The Institute of Materials Engineering, Australia Ltd.
Nogita, K., Couper, M. J. and Dahle, A. K. (2001). Eutectic modification and castability of hypoeutective Al-Si alloys. Japan Institute of Metals Fall Meeting, Japan, 21-23 Sept 2001. Japan: The Japan Institute of Metals.
Nogita, K., Dahle, A. K. and Drennan, J. (2001). Application of EBSD and TEM to determine eutectic solidification mechanisms. Japan Institute of Metals Fall Meeting, Japan, 21-23 Sept 2001. Japan: The Japan Institute of Metals.
Dahle, A. K., Nogita, K., McDonald, S. and Zindel, J. W. (2001). Understanding eutectic formation in hypoeutectic Al-Si alloys. TMS 130th Annual Int. Meeting & Exhibition, New Orleans, USA, 11-15 Feb 2001. USA: TMS.
McDonald, S., Nogita, K., Dahle, A. K., Taylor, J. A. and St John, D. H. (2000). Eutectic solidification and porosity formation in Al-Si alloys: the role of strontium. 104th AFS Casting Congress, Pittsburgh, PA, USA, 8-11 April 2000. Des Plaines, Illinois, USA: American Foundrymen's Society.
Guldbrandsen-Dahl, S., Heiberg, G., Hjelen, J., Nogita, K., Raanes, M. and Dahle, A. K. (2000). Specimen preparation for electron backscatter diffraction (EBSD) analysis of aluminimum silicon cast alloys, electro polishing versus fast atom bombardment (FAB). 12th European Congress on Electron Microscopy (EUREM 12), Brno, Czech Republic, 9-14 July 2000. Brno, Czech Republic: Czechoslovak Society for Electron Microscopy.
Nogita, K. and Dahle, A. K. (2000). Eutectic growth mode in strontium, antimony and phosphorous modified Al-Si foundry alloys. JIM Fall Meeting, Nagoya, Japan, 1-3 October 2000. Japan: Japanese Institute of Metals.
Nogita, K. and Dahle, A. K. (2000). Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD. TMS Fall Meeting, St Louis, MI, USA, 3-6 October 2000. Warrendale, PA, USA: The Minerals, Metals & Materials Society.
Nogita, K., Dahle, A. K., Hogan, L. M. and Drennan, J. (2000). EBSD analysis of eutectic solidification in Al-Si alloys. MicroOZcopy 2000, Canberra, Australia, 6-11 February 2000. Canberra, Australia: