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Mr Jiye Zhou
jiye.zhou@uq.edu.au
Publications
Journal Articles
(5)
Conference Paper
(1)
Thesis
(1)
Journal Articles
Zhou, Jiye
,
Ye, Hanyue
,
Tan, Xin F.
,
McDonald, Stuart D.
and
Nogita, Kazuhiro
(
2026
).
Temperature‐dependent electrical resistivity in In–Sn alloys with varied phase composition and ternary element levels
.
Journal of Materials Science: Materials in Electronics
,
37
(
4
)
293
,
1
-
18
. doi:
10.1007/s10854-026-16650-0
Zhou, Jiye
,
Tan, Xin F.
,
Gu, Qinfen
,
McDonald, Stuart D.
and
Nogita, Kazuhiro
(
2025
).
Unlocking superplasticity and enhanced strength in ultra-low temperature In-Sn-Bi solder alloys via dynamic microstructure engineering
.
Materials Science and Engineering: A
,
944
148897
,
1
-
11
. doi:
10.1016/j.msea.2025.148897
Nogita, Kazuhiro
,
Tan, Xin Fu
,
Zhou, Jiye
,
McDonald, Stuart D.
,
Sweatman, Keith
,
Somidin, Flora
,
Zeng, Guang
,
Maeno, Hiroshi
,
Yasuda, Kazuhiro
and
Gourlay, Christopher M.
(
2025
).
In situ observation of deformation in a Sn-3Ag-0.5Cu/Cu solder joint using high-voltage transmission electron microscopy
.
Materials
,
18
(
16
)
3925
,
1
-
11
. doi:
10.3390/ma18163925
Zhou, Jiye
,
Shahbazi, Mahboobeh
,
Poitras, Jordan T.
,
Tan, Xin Fu
,
McDonald, Stuart D.
and
Nogita, Kazuhiro
(
2025
).
The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys
.
Journal of Electronic Materials
,
54
(
4
),
2628
-
2637
. doi:
10.1007/s11664-024-11584-x
Zhou, Jiye
,
Tan, Xin Fu
,
McDonald, Stuart D.
and
Nogita, Kazuhiro
(
2022
).
Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints
.
Materials
,
15
(
23
)
8321
,
1
-
12
. doi:
10.3390/ma15238321
Conference Paper
Somidin, Flora
,
Akaiwa, Tetsuya
,
McDonald, Stuart D.
,
Nishimura, Tetsuro
,
Ye, Xiaozhou
,
Smith, Anthony
,
Zhou, Jiye
and
Nogita, Kazuhiro
(
2022
).
Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders
.
International Conference on Electronics Packaging (ICEP)
,
Sapporo, Japan
,
11-14 May 2022
.
Piscataway, NJ, United States
:
Institute of Electrical and Electronics Engineers
. doi:
10.23919/ICEP55381.2022.9795417
Thesis
Zhou, Jiye
(
2021
).
Properties control of intermetallic for pb-free micro-electronic interconnect applications
.
Master's Thesis
,
School of Mechanical and Mining Engineering
,
The University of Queensland
. doi:
10.14264/6b388f7