Publications
Conference Papers
Ye, Xiaozhou, McDonald, Stuart D., Tan, Xin Fu, Nishimura, Takatoshi, Sweatman, Keith and Nogita, Kazuhiro (2026). Tensile properties of Sn-37Bi-0.5Sb-0.5Cu-0.03Ni low-temperature soldering alloy. 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), Hiroshima, Japan, 14-18 April 2026. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep-hbs69241.2026.11550708
Ye, Xiaozhou, McDonald, Stuart D., Tan, Xin Fu and Nogita, Kazuhiro (2025). Tensile properties of Sn-37wt%Bi and Sn-57wt%Bi at temperatures below 0°C. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Nagano, Japan, 15 - 19 April 2025. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep-iaac64884.2025.11002926