School of Mechanical & Mining Engineering

Mr Jonathan Read

Manager, Laboratory/ies
School of Mechanical and Mining Engineering
+61 7 334 66227

Publications

Journal Articles (16)
Conference Papers (11)

Journal Articles

Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001
Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027
Nogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381
Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012
Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057
McDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3
Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047
Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058
Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293
Allen, B., Read, J. L. and Medlin, G. (2011). Additional records of small mammals in northern South Australia. Australian Mammalogy, 33 (1), 68-72. doi: 10.1071/AM10032
Gourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5
Tapsall, John, Read, Phillip, Carmody, Christopher, Bourne, Christopher, Ray, Sanghamitra, Limnios, Athena, Sloots, Theo and Whiley, David (2009). Two cases of failed ceftriaxone treatment in pharyngeal gonorrhoea verified by molecular microbiological methods.. Journal of Medical Microbiology, 58 (5), 683-687. doi: 10.1099/jmm.0.007641-0
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54.
Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713
Gourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8
Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi and Dahle, Arne K. (2005). Microstructure control in Sn-0.7mass%Cu alloys. Materials Transactions, 46 (11), 2419-2425. doi: 10.2320/matertrans.46.2419

Conference Papers

Nogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610
Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49
Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58
Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53
Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP).
Sweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011.
Mu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging.
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.
Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.